MN103S55G data ram ( 32-bit) 16 k-byte command rom ( 64-bit) 128 k-byte type MN103S55G (under development) package lqfp128-p-1818c *pb-free minimum instruction execution time 25.0 ns (at 2.7 v to 3.6 v, 40 mhz) interrupts ? reset irq 9 nmi timer 30 sif 10 i 2 c 3 key dma 12 wdt a/d system error timer counter 8-bit timer 10 reload-down count cascade connection possible (usable as a 16-bit to 32-bit timer) 16-bit timer 6 up-down count input capture function pwm generating function compare/capture register 2-ch. time base timer 1, free run counter watchdog timer 1 maf00013aem dma controller number of channels: 4 unit of transfer: 8/16/32 bits max. transfer cycles: 65535 staring factor: external interrupt, timer factor, serial transmission/reception factor, i 2 c transmission/reception factor, external transmission request factor, a/d conversion finish, software factor transfer method: 2-bus cycle transfer adressing modes: fixed, increment, decrement transfer modes: word transfer, burst transfer, intermittent transfer serial interface uart/synchronous/multi-master i 2 c interface selective: 3 uart/synchronous interface selective: 2 i/o pins 109 common use i/o a/d inputs 10-bit 12-ch. electrical characteristics t.b.d. d/a inputs 8-bit 2-ch.
MN103S55G pin assignment maf00013aem type mn103sf55g (under development) command rom ( 64-bit) 128 k-byte data ram ( 32-bit) 16 k-byte minimum instruction execution time 25.0 ns (at 2.7 v to 3.6 v, 40 mhz) package lqfp128-p-1818c *pb-free support tool flash memory built-in type in-circuit emulator px-ice103s55 on-board development tools px-odb103s-o lqfp128-p-1818c *pb-free pd6 p00/nmirq p01/irq8 p02/rwsel/sbi3 p03/as/sb03 p04/sbt3 p05/dk/sbi2 p06/br/sb02/sda2 p07/bg/sbt2/scl2 p36 p37 p30/wdovf/cksel2 p31/cksel p10/an0/sbi0 p11/an1/sbo0/sda0 p12/an2/sbt0/scl0 vss p13/an3 vdd3 p14/an4/sbi1 p15/an5/sbo1/sda1 p16/an6/sbt1/scl1 p17/an7 p20/an8/sbi4 p21/an9/sbo4 p22/an10/sbt4 p23/an11 p24/da0 p25/da1 p26/adtrg avdd p32 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 nrst vss p66/scke vdd3 p65/swe p64/nsras p63/nscas p62/we1/sdqm1 p61/we0/sdqm0 p60/re p57/d15/irq7/ki7* p56/d14/irq6/ki6* p55/d13/irq5/ki5* p54/d12/irq4/ki4* p53/d11 p52/d10 p51/d9 p50/d8 vdd3 p47/d7 p46/d6 p45/d5 p44/d4 p43/d3 p42/d2 p41/d1 p40/d0 memmod mod tmod p35 p34 MN103S55G 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 p96/adm14/a14 p65/adm13/a13 p94/adm12/a12 p93/adm11/a11 p92/adm10/a10 p91/adm9/a9 p90/adm8/a8 p87/adm7/a7 p86/adm6/a6 p85/adm5/a5 vss p84/ad4/a4 p83/adm3/a3 p82/adm2/a2 p81/adm1/a1 p80/adm0/a0 p71/cs3 p72/cs2 p73/cs1 p74/cs0 vdd3 p70/sysclk/sdclk0 vss osco osci pd7 vdd3 vppex xo xi/p75 p33/sdclki p67 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 p97/adm15/a15 pa0/a16 pa1/a17 pa2/a18 pa3/a19 ki4*/pa4/a20 ki5*/pa5/a21 ki6*/pa6/dreq0*/a22 ki7*/pa7/dreq1*/a23 vdd3 pb0/irq0 pb1/irq1 pb2/irq2 pb3/irq3 pb4/tm10ioa/irq4 pb5/tm10iob/irq5 pb6/tm11ioa/irq6 pb7/tm11iob/irq7 pc0/dreq0 pc1/dreq1 pc2/tm12ioa pc3/tm12iob pd0/sbi1*/tm14iob/tm7io pd1/sbo1*/tm15ioa/tm8io/sda1* pd2/sbt1*/tm15iob/tm9io/scl1* pd3/sbi0*/tm13ioa/tm4io pd4/sbo0*/tm13iob/tm5io/sda0* pd5/sbt0*/tm14ioa/tm6io/scl0* ki0/pc4 ki1/pc5 ki2/pc6 ki3/pc7 *at memory expansion mode
request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese government if any of the products or technical information described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. it neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) we are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) the products described in this material are intended to be used for standard applications or general elec- tronic equipment (such as office equipment, communications equipment, measuring instruments and house- hold appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus- tion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (5) the products and product specifications described in this material are subject to change without notice for modification and/or improvement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifica- tions satisfy your requirements. (6) when designing your equipment, comply with the guaranteed values, in particular those of maximum rat- ing, the range of operating power supply voltage, and heat radiation characteristics. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) when using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) this material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. 2003 sep
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